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6 Layers FR4 Base Material 3OZ Electronic HDI PCB

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The project ET1040 is going well. Out Technical Director was telling me that the board was assembled very well. The team is developing the software at the moment. We will have more projects for you, Lynn!!!

—— Taisa Mironova

Excellent service! I will definitely recommend your company to my frined.

—— Sergey Maskalev

I received the boards early this week and tested them. Full success, thank you for this good work. Thanks again.

—— Jalal Fathil

Thanks for the fast production and qualified production

—— Zamar

Lynn is very professional,I love to work with him.

—— Stan Nevedomskis

we are very satisfied with the product,so far everything is doing ok,good job!

—— Patrick Farayi

the delivery time and quality is good, will come back next time.

—— Bassem Fouli

We are satisfied with the last order. You did a great job on making those boards and the lead time is short.I will place another order soon.

—— Akon Malik

Hi Lynn, Received today and will update you soon for the test. Thank you

—— Wally Jankowski

Always my Priority PCB supplier!

—— Adosprm Khamtalob

Thanks to the excellent service, and speed up of the production. It is so glad to work with your company

—— Nedzbedin Rustem

6 Layers FR4 Base Material 3OZ Electronic HDI PCB

6 Layers FR4 Base Material 3OZ Electronic HDI PCB
6 Layers FR4 Base Material 3OZ Electronic HDI PCB 6 Layers FR4 Base Material 3OZ Electronic HDI PCB 6 Layers FR4 Base Material 3OZ Electronic HDI PCB 6 Layers FR4 Base Material 3OZ Electronic HDI PCB

Large Image :  6 Layers FR4 Base Material 3OZ Electronic HDI PCB Get Best Price

Product Details:
Place of Origin: China
Brand Name: OEM/ODM
Certification: UL, Rohs
Model Number: SL00710S15
Payment & Shipping Terms:
Minimum Order Quantity: Negotiable
Price: Negotiable
Packaging Details: ESD Bag
Delivery Time: 7-12 days
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: 5000 Piece/Pieces per Day
Detailed Product Description
Copper Thickness: 1oz,1/2OZ 1OZ 2OZ 3OZ Base Material: FR4
Min. Line Spacing: 4/4mil(0.1/0.1mm) Board Thickness: 0.5~3.2mm
Min. Line Width: 0.075mm/0.075mm(3mil/3mil) Min. Hole Size: 0.20mm,4mil
Surface Finishing: HASL,ENIG Product Name: PCB Assembly
Application: Consumer Electronics Pcb Assembly Method: SMT
High Light:

Electronic HDI PCB

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3OZ HDI PCB

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3OZ electronic PCB board

FR4 HDI PCB 6 layers multilayer printed circuit board Electronic Pcb Board

 

 

HDI PCB fabrication is rapidly becoming the ultimate solution for smaller, more efficient, and more durable PCBs. High-Density Interconnect (HDI) is a high-performance design that is characterized by its high density of components and routing Interconnections that use micro vias, blind and buried via or micro via techniques, and built-up Print Circuit Boards (PCBs) laminations. HDI PCB design is preferable for reducing the overall cost; this is done by decreasing the size and the number of layers as compared to a standard technology PCB design. It also offers better electrical performance and is one of the key technologies driving advancements in PCB electronics.

 

HDI design requires the latest advances in the PCB interconnection technology: With the latest state of the art PCB technology, HDI PCBs can be defined as those printed circuit boards that make use of some or all of the following features; Blind and buried via or micro via techniques, high signal performance considerations, micro vias, and built-up PCB laminations. High-density Interconnection or HDI is a PCB technology that came to the limelight close to the end of the 20th century. Its popularity grew tremendously due to the numerous advantages it holds over the traditional PCBs.

 

The advanced multilayer deployed by HDI PCB manufacturing allows you to integrate multiple layers to create a multi-layered PCB.

 

 

The Six Main Types of HDI PCB Boards


1. Burial through and through channels
2. Use core-free structure with layer pairs.
3. Passive substrate, no electrical connection
4. By surface to surface offset
5. Two / more HDI layers and via vias
6. A core-free alternative structure using a pair of layers.

 

 

PCB Production Capacity

 

Layer count 1-28L,HDI
Material FR-4, High TG FR4, aluminium, FPC
Teflon,PTFE (F4B,F4BK), Rogers (4003,4350,5880)
Max board dimensions 800mm*620mm
Board shape Rectangular,round,slots,cutouts,complex,irregular
Board type Rigid,flexible,rigid-flexible
Board cutting Shear,V-score,tab-routed,counter sunk
Board thickness 0.2~8.0mm, Flex 0.1~0.25mm
Thickness Tolerance ±10%
Min line width / space 3mil/3mil
Minimum Drilling Hole (Mechanical) 0.1mm
Minimum laser hole 0.075mm
Blind Hole/buried plate YES
Hole Position/hole Tolerance PTH:±0.076MM
NPTH:±0.05mm
InnerLayer Copper Thickness 0.5-3 oz
OutLayer Copper Thickness 0.5-4 oz
Impedance control tolerance ±10%
Surface finish HASL,Lead free HASL,ENIG,Immersion Tin,Immersion Silver,OSP...
Solder mask Double-sided green,red,white,blue,black,etc
Silkscreen Double-sided or single-sided in white,black,or negative
PCB Testing E-test, Flying probe test
Acceptable File Format Gerber RS-274X,274D,AutoCAD'S DXF,DWG,Pro-E,Ki-CAD
Quality Standards IPC-A-600F and MIL-STD-105D CHINA GB<4588>

 

 

 

Contact Details
Shenzhen Shinelink Technology Ltd

Contact Person: Xia

Tel: +8613590384973

Send your inquiry directly to us