Payment & Shipping Terms:
|Copper Thickness:||1oz,1/2OZ 1OZ 2OZ 3OZ||Base Material:||FR4|
|Min. Line Spacing:||4/4mil(0.1/0.1mm)||Board Thickness:||0.5~3.2mm|
|Min. Line Width:||0.075mm/0.075mm(3mil/3mil)||Min. Hole Size:||0.20mm,4mil|
|Surface Finishing:||HASL,ENIG||Product Name:||PCB Assembly|
|Application:||Consumer Electronics||Pcb Assembly Method:||SMT|
Electronic HDI PCB,
3OZ HDI PCB,
3OZ electronic PCB board
FR4 HDI PCB 6 layers multilayer printed circuit board Electronic Pcb Board
HDI PCB fabrication is rapidly becoming the ultimate solution for smaller, more efficient, and more durable PCBs. High-Density Interconnect (HDI) is a high-performance design that is characterized by its high density of components and routing Interconnections that use micro vias, blind and buried via or micro via techniques, and built-up Print Circuit Boards (PCBs) laminations. HDI PCB design is preferable for reducing the overall cost; this is done by decreasing the size and the number of layers as compared to a standard technology PCB design. It also offers better electrical performance and is one of the key technologies driving advancements in PCB electronics.
HDI design requires the latest advances in the PCB interconnection technology: With the latest state of the art PCB technology, HDI PCBs can be defined as those printed circuit boards that make use of some or all of the following features; Blind and buried via or micro via techniques, high signal performance considerations, micro vias, and built-up PCB laminations. High-density Interconnection or HDI is a PCB technology that came to the limelight close to the end of the 20th century. Its popularity grew tremendously due to the numerous advantages it holds over the traditional PCBs.
The advanced multilayer deployed by HDI PCB manufacturing allows you to integrate multiple layers to create a multi-layered PCB.
The Six Main Types of HDI PCB Boards
1. Burial through and through channels
2. Use core-free structure with layer pairs.
3. Passive substrate, no electrical connection
4. By surface to surface offset
5. Two / more HDI layers and via vias
6. A core-free alternative structure using a pair of layers.
|Material||FR-4, High TG FR4, aluminium, FPC|
|Teflon,PTFE (F4B,F4BK), Rogers (4003,4350,5880)|
|Max board dimensions||800mm*620mm|
|Board cutting||Shear,V-score,tab-routed,counter sunk|
|Board thickness||0.2~8.0mm, Flex 0.1~0.25mm|
|Min line width / space||3mil/3mil|
|Minimum Drilling Hole (Mechanical)||0.1mm|
|Minimum laser hole||0.075mm|
|Blind Hole/buried plate||YES|
|Hole Position/hole Tolerance||PTH:±0.076MM|
|InnerLayer Copper Thickness||0.5-3 oz|
|OutLayer Copper Thickness||0.5-4 oz|
|Impedance control tolerance||±10%|
|Surface finish||HASL,Lead free HASL,ENIG,Immersion Tin,Immersion Silver,OSP...|
|Solder mask||Double-sided green,red,white,blue,black,etc|
|Silkscreen||Double-sided or single-sided in white,black,or negative|
|PCB Testing||E-test, Flying probe test|
|Acceptable File Format||Gerber RS-274X,274D,AutoCAD'S DXF,DWG,Pro-E,Ki-CAD|
|Quality Standards||IPC-A-600F and MIL-STD-105D CHINA GB<4588>|
Contact Person: Xia