Payment & Shipping Terms:
|PCB Assembly:||Mixed||Board Thickness:||1.2mm|
|Surface Finishing:||HASL||Min. Line Spacing:||4/4mil(0.1/0.1mm)|
|Min. Line Width:||0.075mm/0.075mm(3mil/3mil)||Min. Hole Size:||0.20mm,4mil|
|Pcb Assembly Method:||SMT|
Multilayer BGA PCB Assembly,
Mixed BGA PCB Assembly,
FR4 electronics PCB assembly
Fr4 BGA PCB Assembly , Electronics Circuit Board Mixed Assembly Muti Layers
BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the device can be used, instead of just the perimeter. Soldering of BGA devices requires precise control and is usually done by automated processes.
We offer complete end-to-end manufacturing solutions including material procurement,printed circuit board assembly (PCBA), box-building, system level test, cable and other parts.
Covering the area of 3000㎡, currently SHINELINK factory has around 200 employees and 12 high speed SMT lines. As for manufacturing capacity, the minimum size we are able to mount is 0201. The mounting precision we can meet is +/-0.1 mm, which means we can mount all kinds of chips with different packages, such as SOP, SOJ, TSOP, TTSOP, QFP, BGA, U-BGA and so on. For QFP, we can reach precision +/-0.08mm.
1.Single side wave soldering
2.SMT & THT mixture process
PCB Assembly Capabilities
|Turnkey PCBA||PCB+components sourcing+assembly+package|
|Assembly details||SMT and Thru-hole, ISO lines|
|Lead Time||Prototype: 15 work days. Mass order: 20~25 work days|
|Testing on products||Flying Probe Test, X-ray Inspection, AOI Test, functional test|
|Quantity||Min quantity: 1pcs. Prototype, small order, mass order, all OK|
|Files we need||PCB: Gerber files(CAM, PCB, PCBDOC)|
|Components: Bill of Materials(BOM list)|
|Assembly: Pick-N-Place file|
|PCB panel Size||Min size: 0.25*0.25 inches(6*6mm)|
|Max size: 20*20 inches(500*500mm)|
|PCB Solder Type||Water Soluble Solder Paste, RoHS lead free|
|Components details||Passive Down to 0201 size|
|BGA and VFBGA|
|Leadless Chip Carriers/CSP|
|Double-sided SMT Assembly|
|Fine Pitch to 0.8mils|
|BGA Repair and Reball|
|Part Removal and Replacement|
|Component package||Cut Tape,Tube,Reels,Loose Parts|
|Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing|
1. What factors should be considered when choosing the material for a PCB board?
Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.
2. What’s the merits of O-leading's rIgid-flex PCB?
SHINELINK’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.
3. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.
Contact Person: Xia