Shenzhen Shinelink Technology Ltd

OEM PCB & PCBA Manufacturer

About Us
Factory Tour
Quality Control
Contact Us
Request A Quote
Home ProductsBGA PCB Assembly

3OZ BGA Assembly

I'm Online Chat Now
The project ET1040 is going well. Out Technical Director was telling me that the board was assembled very well. The team is developing the software at the moment. We will have more projects for you, Lynn!!!

—— Taisa Mironova

Excellent service! I will definitely recommend your company to my frined.

—— Sergey Maskalev

I received the boards early this week and tested them. Full success, thank you for this good work. Thanks again.

—— Jalal Fathil

Thanks for the fast production and qualified production

—— Zamar

Lynn is very professional,I love to work with him.

—— Stan Nevedomskis

we are very satisfied with the product,so far everything is doing ok,good job!

—— Patrick Farayi

the delivery time and quality is good, will come back next time.

—— Bassem Fouli

We are satisfied with the last order. You did a great job on making those boards and the lead time is short.I will place another order soon.

—— Akon Malik

Hi Lynn, Received today and will update you soon for the test. Thank you

—— Wally Jankowski

Always my Priority PCB supplier!

—— Adosprm Khamtalob

Thanks to the excellent service, and speed up of the production. It is so glad to work with your company

—— Nedzbedin Rustem

3OZ BGA Assembly

3OZ BGA Assembly
3OZ BGA Assembly 3OZ BGA Assembly 3OZ BGA Assembly 3OZ BGA Assembly

Large Image :  3OZ BGA Assembly Get Best Price

Product Details:
Place of Origin: China
Brand Name: OEM/ODM
Certification: UL, Rohs
Model Number: SL00710S04
Payment & Shipping Terms:
Minimum Order Quantity: Negotiable
Price: Negotiable
Packaging Details: ESD Bag
Delivery Time: 7-12 days
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: 5000 Piece/Pieces per Day
Detailed Product Description
Copper Thickness: 1oz,1/2OZ 1OZ 2OZ 3OZ Base Material: FR-4
Min. Line Spacing: 4/4mil(0.1/0.1mm) Board Thickness: 0.5~3.2mm
Min. Line Width: 0.075mm/0.075mm(3mil/3mil) Min. Hole Size: 0.20mm,4mil
Surface Finishing: HASL,ENIG Product Name: PCB Assembly
Application: Consumer Electronics Pcb Assembly Method: SMT
High Light:

3OZ BGA Assembly


2OZ BGA Assembly


3OZ BGA PCB Assembly

High Quality BGA PCB SMT Assembly Electronics PCBA EMS Service 8 Layers PCB



BGA PCB is Printed Circuit Boards with Ball Grid Array. We use various sophisticated techniques for making BGA PCBs. Such PCBs have a small size, low cost, and high packaging density. Hence, they are reliable for high-performance applications.



Benefits of BGA PCB


1. Efficient Use of Space
BGA PCB layout allows us to efficiently use the available space. Hence, we can mount more components and manufacturer lighter devices.
2. Excellent Thermal and Electrical Performance
The size of the BGA PCB Service is considerably small. Hence, the heat dissipation is relatively much easier. This type of PCB has no pins. Hence, there is no risk of their getting broken or bent. Therefore, the PCB is stable enough to ensure excellent electrical performance.
3. Higher Manufacturing Yields
The most BGA PCB design is smaller in size so they are faster to manufacture. Hence, we get higher manufacturing yields and the process becomes more convenient.
4. Less Damage to Leads
We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during operation.
5. Lower Cost
The smaller size and the convenient manufacturing route ensure that we incur lower manufacturing costs. Hence, this process is ideal for mass production.



BGA PCB Manufacturing


1. We first heat the overall assembly.

2. We use solder balls which have a very controlled amount of solder. So that we can use soldering for heating them.

3. Hence the solder tends to melt.

4. The solder cools down and tends to solidify.

5. However, the surface tension causes the molten solder to assume appropriate alignment with respect to the circuit board.

6. Although it is important to carefully choose the composition of the solder alloy and the corresponding soldering temperature.

7. This is because we have to ensure that the solder doesn’t melt completely. Hence, it stays semi-liquid.

8.Therefore, each ball remains separate from the adjacent ones.




Types of BGA PCBs


1. PBGA (Plastic Ball Grid Array)
So, these use plastic as a packaging material and glass as a laminate.
2. TBGA (Tape Ball Grid Array)
So, these use two types of interconnections. These interconnections are based on lead and inverted solder bonding.
3. CBGA (Ceramic Ball Grid Array)
So, these use a multi-layer ceramic as the substrate material.



Inspection of BGA PCB


We mostly use X-ray inspection for analyzing the features of BGA PCBs. This technique is known as XRD in the industry and relies on X-rays for unveiling the hidden features of this PCB. This kind of inspection reveals,
1. Solder Joint Position
2. Solder Joint Radius
3. Change in Circular shape
4. Solder Joint Thickness 



PCBA Processing Capacity
Processing Service
One Stop PCB Assembly service, include components&plastic mold sourcing,SMT&DIP assembly and enclosure installation service.
Components Package
Smallest with 01005, various chips package as QFN,BGA,SSOP,PLCC,LGA..
100% Function Testing before shipment
Factory Certificate



PCBA Picture

3OZ BGA Assembly 0

Contact Details
Shenzhen Shinelink Technology Ltd

Contact Person: Xia

Tel: +8613590384973

Send your inquiry directly to us