Payment & Shipping Terms:
|Copper Thickness:||1oz,1/2OZ 1OZ 2OZ 3OZ||Base Material:||FR-4|
|Board Thickness:||0.5~3.2mm||Min. Line Spacing:||4/4mil(0.1/0.1mm)|
|Min. Line Width:||0.075mm/0.075mm(3mil/3mil)||Min. Hole Size:||0.20mm,4mil|
|Surface Finishing:||HASL,ENIG||Product Name:||PCB Assembly|
|Application:||Consumer Electronics||Pcb Assembly Method:||SMT|
FR4 BGA PCB Assembly,
2OZ BGA PCB Assembly,
FR4 electronic PCB assembly
PCB Assembly Wireless PCBA custom circuit board smd soldering assembly
This PCBA Board is assembled with FR - 4 made bare pcb board and the board thickness is 1.6 mm, copper thickness is normally 1OZ / 35 µm. Immersion gold surface treatment make the PCBa work longer and more eco-friendly. We need Gerber File & BOM List to produce your PCBa assembly order.
Files Requested For PCB Assembly Quotation
---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required
Shinelink kinds PCBA product
94V0 PCBA manufacture Scale capabilities up to
We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly
SMT process (RoHs Compliant) Capabilities up to:
1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils
THT(Wave soldering) process (RoHs Compliant) Capabilities up to:
1.Single side wave soldering
2.SMT & THT mixture process
PCB Assembly Capabilities
|Turnkey PCBA||PCB+components sourcing+assembly+package|
|Assembly details||SMT and Thru-hole, ISO lines|
|Lead Time||Prototype: 15 work days. Mass order: 20~25 work days|
|Testing on products||Flying Probe Test, X-ray Inspection, AOI Test, functional test|
|Quantity||Min quantity: 1pcs. Prototype, small order, mass order, all OK|
|Files we need||PCB: Gerber files(CAM, PCB, PCBDOC)|
|Components: Bill of Materials(BOM list)|
|Assembly: Pick-N-Place file|
|PCB panel Size||Min size: 0.25*0.25 inches(6*6mm)|
|Max size: 20*20 inches(500*500mm)|
|PCB Solder Type||Water Soluble Solder Paste, RoHS lead free|
|Components details||Passive Down to 0201 size|
|BGA and VFBGA|
|Leadless Chip Carriers/CSP|
|Double-sided SMT Assembly|
|Fine Pitch to 0.8mils|
|BGA Repair and Reball|
|Part Removal and Replacement|
|Component package||Cut Tape,Tube,Reels,Loose Parts|
|Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing|
1. What data are needed for PCB & PCBA production?
1.1 BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
1.2 PCB Gerber files.
1.3 PCB fabrication drawing and PCBA assembly drawing.
1.4 Test procedures.
1.5 Any mechanical restrictions such as assembly height requirements.
2. How do Shinelink ensure quality?
Our high quality standard is achieved with the following.
2.1 The process is strictly controlled under ISO 9001:2008 standards.
2.2 Extensive use of software in managing the production process
2.3 State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
2.4.Dedicated quality assurance team with failure case analysis process
2.5.Continuous staff training and education
Contact Person: Xia